[agents] Call for Reviewers and Last Chance: (Springer(LNCS)): Software engineering(AI and Computational applications) Conferences: SEPA(aplications in all domains), ISSQ(Quality Aspects) and TTSDP(Tools for industrial applications) 2023 (reduced fees for online presentation))@ICCSA, 03-06 July 2023, Athens, Greece
Sanjay Misra
sanjay.misra at covenantuniversity.edu.ng
Mon Apr 17 04:19:05 EDT 2023
*Highlights:* SEPA covers applications of AI and computation techniques(in
all domains), ISSQ covers quality aspects and TTSDP covers short
papers(Students works) on tools and techniques in real life and industrial
applications in any area/domain, Publication in the most reputed series of
Springer(LNCS), has low registration(*180€*) for online presentations, and
is indexed in CORE, SCOPUS, and Web of Science, Several Best paper
award(500EURO each) and JCR Publications
*IMP *-Don't Forget to select the right Session (you need to select the
correct session JUST BELOW TO the box for Abstract and Keywords) while
submitting- at ess.iccsa.org
[image: image.png]
SEPA 2023: 15th International Symposium Software Engineering Processes and
Applications
Link:
http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171724©ownerid=3644
When Jul 3, 2023 - Jul 6, 2023
Where Athens, Greece
Submission Deadline Apr 20, 2023
Notification Due Apr 30, 2023
Final Version Due May 12, 2023
*Categories* <http://www.wikicfp.com/cfp/allcat> software applications
<http://www.wikicfp.com/cfp/call?conference=software%20applications>
artificial
intelligence
<http://www.wikicfp.com/cfp/call?conference=artificial%20intelligence>
advanced
applications
<http://www.wikicfp.com/cfp/call?conference=advanced%20applications> software
engineering
<http://www.wikicfp.com/cfp/call?conference=software%20engineering>
Call For Papers
SEPA 2023: 15th International Symposium on Software Engineering Processes
and Applications
Publisher- Springer LNCS, Special issues- in Several SCIE/SCOPUS Indexed
Journal
The conference is planned to be organized in Blended form (physical
presentation and online presentations).
The accepted papers will be published in Lecture Notes in Computer Science
by Springer
https://sites.google.com/view/ssepa/home
http://www.iccsa.org/workshops
Following the grand success of SEPA 2022(Malaga, Spain), SEPA 2021(BLENDED
MODE) and SEPA 2020(Online), SEPA 2019 (in Saint Petersburg, Russia), SEPA
2018(In Melbourne, Australia), SEPA 2017(in Trieste, Italy), SEPA 2016 (in
Beijing, China), SEPA 2015 (in Banff, Canada), SEPA 2014 (in Guimaraes,
Portugal), SEPA 2013 (in Ho Chi Ming, Vietnam), SEPA 2012 (in Salvador,
Brazil), SEPA 2011 (in Santander, Spain), SEPA 2010 (in Fukuoka, Japan),
SEPA 2009 (in Sowon, Korea), SEPA 2022 (in conjunction with ICCSA 2022) is
scheduled to be held during July 3 - 6, 2023 in collaboration with the
National Technical University of Athens and the University of the Aegean,
Athens, Greece.
Submission deadline: April 20, 2023
About the Workshop and Topics
Software Engineering Processes and Applications (SEPA: 2023) is aimed to
provide a forum to scientists/researchers/engineers/practitioners and
academicians to share their ideas, experiences, and research in the field
of software engineering (AI/ML) and its applications in various domains.
SEPA 2023 covers all the frontier issues and trends in the modern software
engineering process and development in various application areas through
various emerging tools using AI and ML. It includes process models, the
development processes for different software platforms (e.g., social
networks, cloud), a process for adaptive, dependable, embedded systems,
agile development, software engineering practices, requirements, system,
and design engineering including architectural design, component-level
design, formal methods, software modeling, testing strategies and tactics,
process and product metrics, Web Engineering, project management, risk
management, and configuration management. SEPA also invites papers for the
development process of the software/software systems in application areas
(e.g. agriculture, aviation industry, business, cyber-crime, education,
government, military, etc.) by utilizing modern software engineering tools
(AI/ML and various computational techniques).
SEPA invites you to submit theme papers that describe original and
significant contributions in all the above-mentioned areas of software
engineering and its applications. The paper submitted to SEPA 2023 must not
be submitted elsewhere, either in a conference or journal, and should be 12
- 16 pages (LNCS style). Papers selected after peer review will be included
in the Lecture Notes in Computer Science published by Springer (only after
completing the registration) Publication
All contributions will be reviewed by international program committee
members and judged on their quality and relevance. The accepted papers for
SEPA 2023 will be published in Lecture Notes in Computer Science as a book
series of Computational Science and Its Applications: ICCSA. Please note
that one of the authors of the accepted
paper should be registered and supposed to present the paper at the
conference (virtual presentation is allowed for authors who cannot attend
the conference). The extended version of selected papers will also be
invited for publication in several journals (All Web of Science and
SCOPUS-indexed journals), including the best papers
in SCIE-indexed journals*.
*Special issues In SCIE Journals- Information Technology And Controls,
Applied Science, Electronics are confirmed for best papers of the software
engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023).
https://www.mdpi.com/topics/Software_Engineering_Applications
Submission
Please submit your paper through ICCSA 2023 conference website.
Submission site: http://ess.iccsa.org/cgi-bin/login.py
while submitting to the conference site, please select the track of your
submission, "15th International Symposium on Software Engineering Processes
and Applications (SEPA 2023)".
Important Dates:
April 20, 2023: Deadline for abstract and paper submission
April 30, 2023: Notification of Acceptance
May 12, 2023: Submission deadline for the final version of the Proceeding
Paper (hard deadline)
May 12, 2023: Registration ends (hard deadline).
July 3-6, 2023: SEPA at ICCSA 2023 Conference in Athens, Greece
International Program Committee
Organizing Chair (Contact)
Sanjay Misra
Institute of Energy Technology, Halden, Norway
ssopam at gmail.com, sanjay.misra at ife.no
Programme Committee Chair
Robertas Damasevicius
Department of Software Engineering
Kaunas University of Technology, Kaunas, Lithuania
robertas.damasevicius at ktu.lt
_______________________________________________________________________________________________________________
ISSQ 2023 : 14th International Symposium on Software Quality
Link:
http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171726©ownerid=3644
When Jul 3, 2023 - Jul 6, 2023
Where Athens, Greece
Submission Deadline Apr 20, 2023
Notification Due Apr 30, 2023
Final Version Due May 12, 2023
*Categories* <http://www.wikicfp.com/cfp/allcat> software quality
assurance
<http://www.wikicfp.com/cfp/call?conference=software%20quality%20assurance>
quality standards
<http://www.wikicfp.com/cfp/call?conference=quality%20standards> quality
models <http://www.wikicfp.com/cfp/call?conference=quality%20models> quality
practics <http://www.wikicfp.com/cfp/call?conference=quality%20practics>
Call For Papers
ISSQ 2023: 14th International Symposium on Software Quality(Springer-LNCS)
in conjunction with ICCSA 2023
The conference is planned to be organized in Blended form (physical
presentation and online presentations).
The accepted papers of ISSQ 2023 will be published in Lecture Notes in
Computer Science and an extended version of all papers will be invited to
publish in several International Journals- All Web of Science/SCOPUS
Indexed Journals. Special issues in SCIE Journals- Information Technology
And Controls, Applied Science, Electronics are confirmed for best papers of
the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA
2023.
https://www.mdpi.com/topics/Software_Engineering_Applications).
Following the grand success of ISSQ 2022(Malaga, Spain), ISSQ 2021(Blended
form in Cagliari, Italy (2021)), ISSQ 2020 (Online), ISSQ 2019 (in Saint
Petersburg, Russia),, ISSQ 2018(In Melbourne, Australia), ISSQ 2017(in
Trieste, Italy), SQ 2016(in Beijing, China), SQ 2015(in Banff, Canada), SQ
2014 (in Guimaraes, Portugal), SQ 2013 (in Ho Chi Minh City, Vietnam), SQ
2012 (in Salvador, Brazil), SQ 2011 in conjunction with ICCSA 2011 (in
Santander, Spain), and SQ 2009 in ISCIS 2009 (in Middle East Technical
University North Cyprus Campus, Cyprus), ISSQ 2023 (in conjunction with
ICCSA
2023) is scheduled to be held during July 3 - 6, 2023 in collaboration with
the National Technical University of Athens and the University of the
Aegean, Athens, Greece.
Submission deadline: April 20, 2023
About the Workshop and Topics
This symposium extends the discussion of software quality issues in modern
software development processes. It covers s all the aspects of process and
product quality, quality assurance and standards, quality planning, quality
control, and software quality challenges. It also covers the frontier
issues and trends for achieving quality
objectives. It includes the quality management process, the role of
software metrics, predictor metrics, and control metrics, the role of
measurement in accessing the quality, and limitations.
Topics include (related to quality issues in software, software
applications in any related area-cloud, agile, IoT, Big data, and smart
applications) but are not limited to:
1. Software development fundamentals,
2. Extreme Programming (XP), Agile, Scrum,
3. Software requirements techniques,
4. Software testing & QA fundamentals,
5. Software testing models and approaches,
6. Software testing tools and frameworks,
7. Software test design,
8. Types of software maintenance,
9. Software maintenance process models,
10. Software maintenance standards,
11. Software maintenance tools
12. Software Reviews (SR)
13. Software Metrics (SM)
14. Software Process Assessment (SPA)
15. Software Process Improvement (SPI)
16. Software Standardization and Certification
ISSQ: 2023 invites you to submit your work that describes original and
significant contributions in all the above-mentioned areas of software
engineering processes. The paper submitted to ISSQ 2023 must not be
submitted elsewhere, either in a conference or journal. Papers selected
after peer review will be included in the conference proceedings (after
registration) and presented virtually at the conference.
Publication
All contributions will be peer-reviewed and will be judged on their quality
and relevance. The accepted papers for ISSQ 2023 will be published in
Proceedings of ICCSA by Springer in Lecture Notes in Computer Science.
Please note that one of the authors of the accepted paper must register for
the conference. Extended and modified versions
of all accepted papers are invited to publish in various journals (all
SCIE/Web of Science/SCOPUS/ESCI indexed) including best papers in
SCIE-indexed Journals.
Submission
Please submit your paper through ICCSA 2023 conference website.
Submission site: http://ess.iccsa.org/cgi-bin/login.py
IMP: While submitting to the conference site, please check the track of
your submission "14th International Symposium on Software Quality (ISSQ
2023)"
Important Dates
April 20, 2023: Deadline for abstract and paper submission
April 30, 2023: Notification of Acceptance
May 12, 2023: Submission deadline for the final version of the Proceeding
Paper (hard deadline)
May 12, 2023: Registration ends (hard deadline).
July 3-6, 2023: SEPA at ICCSA 2023 Conference in Athens, Greece
Organizing Chair
Sanjay Misra
Institute of Energy Technology, Halden, Norway
ssopam at gmail.com, sanjay.misra at ife.no
Programme Committee Chair
Luis Fernandez-Sanz
Department of Computer Science
University De Alcala, Spain
luis.Fernandez.sanz at uah.es
______________________________________________________________________________________________________________
TTSDP 2023: 15th International Workshop on Tools and Techniques in Software
Development Process
Link: https://sites.google.com/site/tandtinsdp/home
When Jul 3, 2023 - Jul 6, 2023
Where Athens, Greece
Submission Deadline Apr 20, 2023
Notification Due Apr 30, 2023
Final Version Due May 12, 2023
*Categories* <http://www.wikicfp.com/cfp/allcat> software industry
<http://www.wikicfp.com/cfp/call?conference=software%20industry> industrial
applications
<http://www.wikicfp.com/cfp/call?conference=industrial%20applications>
software
techniques
<http://www.wikicfp.com/cfp/call?conference=software%20techniques> software
tools <http://www.wikicfp.com/cfp/call?conference=software%20tools>
Call For Papers
TTSDP 2023: 15th International Workshop on Tools and Techniques in Software
Development Process
The conference is planned to be organized in Blended form (physical
presentation and online presentations). 15th International Workshop on
"Tools and Techniques in Software Development Process" in conjunction with
The 2023 International Conference on Computational Science and Its
Applications (ICCSA 2023). It will be held
during July 3 - 6, 2023, in collaboration with the National Technical
University of Athens and the University of the Aegean, Athens, Greece.
https://sites.google.com/site/tandtinsdp/home
Accepted papers will be published in Lecture Notes in Computer Science by
Springer.
The extended version of all presented papers will also be invited for
publication in
International Scientific Journals(All indexed in SCOPUS/Web of
Science/ECIE).
https://www.mdpi.com/topics/Software_Engineering_Applications
Submission deadline: April 20, 2023
About the Workshop and Topics
The Tools and Techniques in Software Development Processes (TTSDP 2023)
provide a forum for researchers, and practitioners to share their new
achievements, tools, and techniques in the field of the software
development process. TTSDP especially invites experience papers from
industry and academia, short papers, reports, surveys, working papers/work
in progress, and industrial reports. Review/Comment papers are also welcome
with the limitation that the paper should be on a general problem/topic in
the field (no comments are allowed on a particular paper). TTSDP covers all
the aspects of the development process: process models, agile development,
software engineering practices, requirements, system, and design
engineering, including architectural design, software modeling, testing
strategies and tactics, process and product metrics for each phase of
software development, component-based software engineering, software
quality, verification, validation techniques, and software project
management.
TTSDP 2023 invites you to submit your work that describes original and
significant contributions in all areas of the software development process.
The paper submitted to TTSDP 2023 must not submit elsewhere, either in a
conference or journal, and should be in IEEE style. Papers selected after
peer review will be included in the conference proceedings and presented
virtually at the conference.
TTSDP 2023 invites you to submit three different types of session papers (8
to 18 pages long) on all the above-mentioned topics:
Research papers((12-18 pages in LNCS Format)): Papers that describe
original and significant contributions in all areas of the software
development process.
Experience paper (8-11 pages in LNCS Format): papers from the field
describing real-world experience related to the software development
process.
Short paper and reports(8-11 pages in LNCS Format): Papers that allow the
explanation of ideas that are not yet fully validated. Review articles (not
on a particular paper), comparative studies, and survey reports are welcome.
The paper submitted to TTSDP 2023 must not have been submitted elsewhere,
either in a conference or journal, and must be in LNCS style. Papers
selected after review will be included in the conference proceedings and
presented orally at the conference.
Publication
All accepted workshop (TTSDP) papers will be included in the proceeding of
ICCSA 2023, published by Springer. One of the authors of the accepted paper
is required to register and is expected to present the paper at the
conference. Extended and modified versions of all accepted papers are
invited to publish in various journals
(all Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE
indexed Journal.
Submission site: http://ess.iccsa.org/cgi-bin/login.py
IMP: While submitting to the conference site, please select the track of
your submission, "15th International Workshop on Tools and Techniques in
Software Development Processes (TTSDP 2023)".
Proceedings Format: Please follow the Springer LNCS proceedings guidelines
for preparing your paper.
https://www.springer.com/gp/computer-science/lncs/conference-proceedings-guidelines
Special ISSUES:
The accepted papers of TTSDP 2023 will be published in Lecture Notes in
Computer Science and an extended version of all papers will be invited to
publish in several International Journals- All Web of Science/SCOPUS
Indexed Journals. Special issues in SCIE Journals- Information Technology
And Controls, Applied Science, Electronics are confirmed for best papers of
the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA
2023).
https://www.mdpi.com/topics/Software_Engineering_Applications.
Important Dates
April 20, 2023: Deadline for abstract and paper submission
April 30, 2023: Notification of Acceptance
May 12, 2023: Submission deadline for the final version of the Proceeding
Paper (hard deadline)
May 12, 2023: Registration ends (hard deadline).
July 3-6, 2023: SEPA at ICCSA 2023 Conference in Athens, Greece
Organizing Chair
Sanjay Misra
Institute of Energy Technology, Halden, Norway
ssopam at gmail.com, sanjay.misra at ife.no
Program Chair
Lov Kumar
National Institute of Technology, Kurukshetra, India
lovkumar at nitkkr.ac.in
Rytis Maskeliunas
Kaunas University of Technology, Lithuania
rytis.Maskeliunas at ktu.lt
International Programme Committee Members
Raj Kumar Buyya, University of Melbourne, Australia
Mario Fusani, National Research Council of Italy
Daniel Rodríguez, University of Alcalá, Spain
Robertas Damasevicius, Kaunas University of Technology, Lithuania
Reda Alhajj, University of Calgary, Canada
Emilia Mendes, Blekinge Institute of Technology, Sweden
Vahid Garousi, Queen's University Belfast, UK
Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV,
Chile
Michel dos Santos Soares, Federal University of Sergipe, Brazil
V. B. Singh, JNU, Delhi, India
José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico
Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile
Eduardo Guerra, National Institute of space research, Sao Jose, Brazil
Murat Koyuncu, Atilim University, Turkey
Rytis Maskeliunas, Kaunas University of Technology, Lithuania
Tolga Pustali, Cankaya University, Turkey
Matthew O. Adigun, University of Zululand, South Africa
Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain
Ibrahim Akman, Atilim University, Ankara, Turkey
Marco Crasso, UNICEN University, Argentina
Markus Holopainen, University of Helsinki, Finland
Takashi Michikawa, Research Center for Advanced Science and Technology
(RCAST), Japan
Cristian Mateos, UNICEN University, Argentina
Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam
Alejandro Zunino, UNICEN University, Argentina
Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil
Ravin Ahuja, University Of Delhi, India
Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India
Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas,
Colombia
Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea
Adewole Adewumi, Algonquin College, Canada
Matthew Adigun, University of Zululand, South Africa
Luis Fernandez Sanz, Universidad de Alcala, Spain
Ayush Dogra, CSIR-CSIO, Chandigarh, India
Ayan Chatterjee, Simula Research Laboratory, Norway
Hasan Ogul, Østfold University, Halden, Norway
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