[agents] TTSDP(Springer: LNCS):15th International Workshop on Tools and Techniques in Software Development Process(Springer(LNCS):)

[Sanjay Misra]

*Highlights:* TTSDP 2023 covers tools and techniques for real-life and
industrial applications,  Publication in the most reputed series of
Springer(LNCS), has low registration(*180€*) for online presentations, and
is indexed in CORE, SCOPUS, and Web of Science

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Link: https://sites.google.com/site/tandtinsdp/home

When Jul 3, 2023 - Jul 6, 2023
Where Athens, Greece
Submission Deadline Mar 26, 2023
Notification Due Apr 16, 2023
Final Version Due May 7, 2023
*Categories* <http://www.wikicfp.com/cfp/allcat>    software industry
<http://www.wikicfp.com/cfp/call?conference=software%20industry>   industrial
applications
<http://www.wikicfp.com/cfp/call?conference=industrial%20applications>
  software
techniques
<http://www.wikicfp.com/cfp/call?conference=software%20techniques>   software
tools <http://www.wikicfp.com/cfp/call?conference=software%20tools>


Call For Papers

TTSDP 2023: 15th International Workshop on Tools and Techniques in Software
Development Process

The conference is planned to be organized in Blended form (physical
presentation and online presentations). 15th International Workshop on
"Tools and Techniques in Software Development Process" in conjunction with
The 2023 International Conference on Computational Science and Its
Applications (ICCSA 2023). It will be held
during July 3 - 6, 2023, in collaboration with the National Technical
University of Athens and the University of the Aegean, Athens, Greece.

https://sites.google.com/site/tandtinsdp/home

Accepted papers will be published in Lecture Notes in Computer Science by
Springer.

The extended version of all presented papers will also be invited for
publication in
International Scientific Journals(All indexed in SCOPUS/Web of
Science/ECIE).
https://www.mdpi.com/topics/Software_Engineering_Applications

Submission deadline: March 26, 2023

About the Workshop and Topics

The Tools and Techniques in Software Development Processes (TTSDP 2023)
provide a forum for researchers, and practitioners to share their new
achievements, tools, and techniques in the field of the software
development process. TTSDP especially invites experience papers from
industry and academia, short papers, reports, surveys, working papers/work
in progress, and industrial reports. Review/Comment papers are also welcome
with the limitation that the paper should be on a general problem/topic in
the field (no comments are allowed on a particular paper). TTSDP covers all
the aspects of the development process: process models, agile development,
software engineering practices, requirements, system, and design
engineering, including architectural design, software modeling, testing
strategies and tactics, process and product metrics for each phase of
software development, component-based software engineering, software
quality, verification, validation techniques, and software project
management.

TTSDP 2023 invites you to submit your work that describes original and
significant contributions in all areas of the software development process.
The paper submitted to TTSDP 2023 must not submit elsewhere, either in a
conference or journal, and should be in IEEE style. Papers selected after
peer review will be included in the conference proceedings and presented
virtually at the conference.

TTSDP 2023 invites you to submit three different types of session papers (8
to 18 pages long) on all the above-mentioned topics:

Research papers((12-18 pages in LNCS Format)): Papers that describe
original and significant contributions in all areas of the software
development process.

Experience paper (8-11 pages in LNCS Format): papers from the field
describing real-world experience related to the software development
process.

Short paper and reports(8-11 pages in LNCS Format): Papers that allow the
explanation of ideas that are not yet fully validated. Review articles (not
on a particular paper), comparative studies, and survey reports are welcome.

The paper submitted to TTSDP 2023 must not have been submitted elsewhere,
either in a conference or journal, and must be in LNCS style. Papers
selected after review will be included in the conference proceedings and
presented orally at the conference.

Publication

All accepted workshop (TTSDP) papers will be included in the proceeding of
ICCSA 2022, published by IEEE Xplore. One of the authors of the accepted
paper is required to register and is expected to present the paper at the
conference. Extended and modified versions of all accepted papers are
invited to publish in various journals
(all Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE
indexed Journal.

Submission site: http://ess.iccsa.org/cgi-bin/login.py

IMP: While submitting to the conference site, please select the track of
your submission, "15th International Workshop on Tools and Techniques in
Software Development Processes (TTSDP 2023)".

Proceedings Format: Please follow the Springer LNCS proceedings guidelines
for preparing your paper.
https://www.springer.com/gp/computer-science/lncs/conference-proceedings-guidelines

Special ISSUES:

The accepted papers of TTSDP 2023 will be published in Lecture Notes in
Computer Science and an extended version of all papers will be invited to
publish in several International Journals- All Web of Science/SCOPUS
Indexed Journals. Special issues in SCIE Journals- Information Technology
And Controls, Applied Science, Electronics are confirmed for best papers of
the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA
2023).
https://www.mdpi.com/topics/Software_Engineering_Applications.


Important Dates


March 26, 2023: Deadline for abstract and paper submission
April 16, 2023: Notification of Acceptance
May 7, 2023: Submission deadline for the final version of the Proceeding
Paper (hard deadline)
May 7, 2023: Registration ends (hard deadline).
July 3-6, 2023: SEPA at ICCSA 2023 Conference in Athens, Greece

Organizing Chair

Sanjay Misra
Ostfold University, Halden, Norway
ssopam at gmail.com


Program Chair

Lov Kumar
National Institute of Technology, Kurukshetra, India
lovkumar at nitkkr.ac.in

Rytis Maskeliunas
Kaunas University of Technology, Lithuania
rytis.Maskeliunas at ktu.lt

International Programme Committee Members

Raj Kumar Buyya, University of Melbourne, Australia
Mario Fusani, National Research Council of Italy
Daniel Rodríguez, University of Alcalá, Spain
Robertas Damasevicius, Kaunas University of Technology, Lithuania
Reda Alhajj, University of Calgary, Canada
Emilia Mendes, Blekinge Institute of Technology, Sweden
Vahid Garousi, Queen's University Belfast, UK
Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV,
Chile
Michel dos Santos Soares, Federal University of Sergipe, Brazil
V. B. Singh, JNU, Delhi, India
José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico
Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile
Eduardo Guerra, National Institute of space research, Sao Jose, Brazil
Murat Koyuncu, Atilim University, Turkey
Rytis Maskeliunas, Kaunas University of Technology, Lithuania
Tolga Pustali, Cankaya University, Turkey
Matthew O. Adigun, University of Zululand, South Africa
Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain
Ibrahim Akman, Atilim University, Ankara, Turkey
Marco Crasso, UNICEN University, Argentina
Markus Holopainen, University of Helsinki, Finland
Takashi Michikawa, Research Center for Advanced Science and Technology
(RCAST), Japan
Cristian Mateos, UNICEN University, Argentina
Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam
Alejandro Zunino, UNICEN University, Argentina
Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil
Ravin Ahuja, University Of Delhi, India
Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India
Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas,
Colombia
Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea
Adewole Adewumi, Algonquin College, Canada
Matthew Adigun, University of Zululand, South Africa
Luis Fernandez Sanz, Universidad de Alcala, Spain
Ayush Dogra, CSIR-CSIO, Chandigarh, India
Ayan Chatterjee, Simula Research Laboratory, Norway
Hasan Ogul, Østfold University, Halden, Norway
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