[agents] CFPs CLSP 2022 International Conference on Changing Landscape in the Semiconductor Packaging (CLSP)

[Hana Gharrad]

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INTERNATIONAL CONFERENCE ON CHANGING LANDSCAPE IN THE SEMICONDUCTOR
PACKAGING

Date: December 12-13, 2022
Location: Madeira, Portugal
Website: http://wsconf.org/Conference/CLSP
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Semiconductor Packaging is progressively driving chip development, and the
heterogeneous mix is at the front line of these mechanical advances that
are expanding the intricacy of semiconductor plans and testing. To assist
with beating this test, chip originators are sending state-of-the-art
advancements like enormous information and computerized reasoning (AI) to
make testing more proficient and powerful. The Digital Transformation of
Electronics Packaging, especially of ICs (Integrated Circuits), Sensors and
MEMS (Micro-Electro-Mechanical Systems), MOEMS (Micro-Optoelectronic
Mechanical Systems), and Photonics passes on is acquiring and more
importance in the present business applications. Particularly for AI,
AR/VR, and IoT the presentation, form factor, and cost are huge markers.
Scaling down and an expanding level of joining at bundling level targets
greater usefulness on less space, which is promising higher framework
execution, more modest framework size, and lower framework cost. This
requires a framework-level methodology with Chip-Package-Board co-plan and
co-improvement with close participation along with the total semiconductor
inventory network. Changing Landscape in the Semiconductor Packaging (CLSP)
Conference is devoted to uniting countless different academic occasions for
show inside the meeting program. Occasions will run throughout a range of
time during the gathering relying upon the number and length of the
introductions. With its great, it offers an extraordinary benefit for
understudies, scholastics and semiconductor’s industry scientists.


Important Dates:
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 - Paper Submission Due:  September 19, 2022
 - Acceptance Notification:  October 10, 2022
 - Final Manuscript Due:   November 18, 2022
Publication
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All CLSP 2022 accepted papers will be published by Elsevier Science in the
open-access Procedia Computer Science series on-line. Procedia Computer
Science is hosted by Elsevier on www.Elsevier.com<http://www.elsevier.com/>
and on Elsevier content platform ScienceDirect (www.sciencedirect.com<
http://www.sciencedirect.com/>), and will be freely available worldwide.
All papers in Procedia will be indexed by Scopus (www.scopus.com<
http://www.scopus.com/>) and by Thomson Reuters? Conference Proceeding
Citation Index (
http://thomsonreuters.com/conference-proceedings-citation-index/). All
papers in Procedia will also be indexed by Scopus (www.scopus.com<
http://www.scopus.com/>) and Engineering Village (Ei).This includes EI
Compendex (www.ei.org/compendex<http://www.ei.org/compendex>). Moreover,
all accepted papers will be indexed in DBLP (http://dblp.uni-trier.de/).
The papers
will contain linked references, XML versions and citable DOI numbers.
Selected papers will be invited for publication, in the special issues of:
    - International Journal of Intellectual Property Enforcement,
Technology Transfer and Innovation in China's Semiconductor Industry, SSRN (
https://www.journals.elsevier.com/journal-of-public-transportation)
Papers on either completed or ongoing research are invited in the following
and related tracks: http://wsconf.org/Conference/CLSP
CLSP 2022 will be held in the city of Madeira. It is an autonomous region
of Portugal and is an archipelago comprising 4 islands off the northwest
coast of Africa. Madeira is home to The University of Madeira created in
1988 in Funchal, Madeira.

Conference Tracks
===============
Track 1: HETEROGENEOUS INTEGRATION (HI)

Track 2: ADVANCED PACKAGING ROADMAP AND MARKET UPDATES
• The Growing Momentum of Heterogeneous Integration
• Challenges for Heterogeneous Integration in Package – Applications
• Driving Materials and Processes towards Diversity
• Micro Balling on Chips with a High Ball-count for Space Applications
• Big Data and Vehicle Analytics
• Vehicular Networks
• Security and Safety

Track 3: PACKAGING TECHNOLOGY & PROCESSES
• Active Mold Packaging for Novel Antenna-in-Package Interconnection and
Manufacturing
• High Throughput & High Yield Heterogeneous Integration with Implemented
Metrology for Collective D2W Bonding
• High Throughput & High Yield Heterogeneous Integration with Implemented
Metrology for Collective D2W Bonding

Track 4: PACKAGE SIMULATION, EVALUATION & CHARACTERIZATION
• Heterogeneous Integration Test Impacts
• 3D Bump Metrology and Inspection
• Intelligent Infrastructure and Guidance Systems
• Intertwined development of manufacturing processes and test technologies
– a prerequisite for future success in advanced packaging
• Virtual Prototyping for System-in-Package with Heterogeneous Integration

Track 5: CASE STUDIES OF ENABLING DIGITALIZATION IN KEY INDUSTRIES WITH
ADVANCED PACKAGING SOLUTIONS

Track 6: UPDATES IN MANUFACTURING EQUIPMENT WITH ADVANCED CAPABILITIES
• Processing of new functional materials
• Manufacturing process IP

Track 7:  DESIGN FOR RELIABILITY AND PERFORMANCE
• EDA (Electronic Design Automation)
• Simulation tools and methods for enhancing SiP
• Chip-Package-Board co-design

Committees
==========

Committee Members:

Dr Panagiotis Alevyzakis, Universita degli Studi Guglielmo Marconi, Italy.


CONTACT
For more information, please send an email to clsp at wsconf.org
https://wsconf.org
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